Heating System Component for Sensing a First and Second Temperature

A method for manufacturing a heating system component, wherein the heating system component comprises a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side, a heating unit, a heat conducting plate that comprises a first heat capturing plate portion, a second heat capturing plate portion, a first heat releasing plate portion, and a second heat releasing plate portion, at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area, and a housing, the method comprising the steps of

• arranging the heating unit at least partially in the groove of the carrier unit;
• providing of the heat conducting plate assembly wherein the first heat capturing plate portion is connected with the second heat capturing plate portion and/or the first heat releasing plate portion is connected with the second heat releasing plate portion;
• thermally coupling the first heat capturing plate portion to the heating unit and the second heat capturing plate portion to the medium leading section of the carrier unit;
• separating the connection between the first heat capturing plate portion and the second heat capturing plate portion and/or the first heat releasing plate portion and the second heat releasing plate portion;
• and
• accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in the housing in such a way that the first sensor area is thermally coupled to the first heat releasing plate portion and the second sensor area is thermally coupled to the second heat releasing plate portion.