Light emitting device and light source module

A light emitting device, comprising:

• a base at least including a first substrate and n through holes, wherein each of the n through holes passes through the first substrate;
• a conductive unit including m conductors, wherein the m conductors are separate from each other and each of the m conductors passes through the first substrate, wherein each of the m conductors includes a chip bonding pad, a solder pad, and a first connection, wherein the chip bonding pad is disposed on a top surface of the base, the solder pad is exposed from a bottom surface of the base, and the first connection is connected between the chip bonding pad and the solder pad, and wherein a part of the first connection is arranged in the through hole;
• at least one chip scale packaging light emitting diode (CSP-LED) correspondingly and electrically connected to neighboring two of the m conductors;
• and
• a package covering the at least one CSP-LED;
• wherein the at least one CSP-LED includes an encapsulate formed on a light emitting chip, and the encapsulate and the package have different optical properties;
• wherein m and n are integers greater than or equal to 2, and m is greater than or equal to n.