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US 2022/0178071 A1Published application
Non-woven film for electronic components and fabricating method thereof
AssigneeTaiwan Textile Research Institute
InventorsShao-Yen CHANG, Shang-Chih CHOU, Chun-Hung LIN
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Abstract
A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.
Claims10
A non-woven film for electronic components, comprising:
- a polyetherimide substrate;
- and
- an aerogel disposed on the polyetherimide substrate and having a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.
A fabricating method of a non-woven film for electronic components, comprising:
- providing a polyetherimide substrate and an aerogel dispersion, wherein the aerogel dispersion comprises an aerogel, and the aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%;
- dipping the polyetherimine substrate in the aerogel dispersion, such that the aerogel dispersion covers the polyetherimine substrate;
- performing a thermal compression process on the polyetherimide substrate, such that the aerogel and the polyetherimide substrate are composited with each other;
- and
- performing an ultrasonic oscillating process on the polyetherimine substrate, such that the aerogel not being composited with the polyetherimine substrate is removed.
2 more elements
Dependencies are inferred from the claim text.