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US 2022/0178046 A1Published application
Plating apparatus and plating method
AssigneeEbara Corporation
InventorsMasaki Tomita, Masaya Seki, Masashi Shimoyama, Shao Hua Chang
Life of this patent
Estimating the term…
Abstract
A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410, a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440, and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.
Claims18
A plating apparatus comprising:
- a plating tank for housing a plating solution;
- an anode arranged in the plating tank;
- a substrate holder for holding a substrate with a surface to be plated facing downward;
- a rotation mechanism for rotating the substrate holder;
- and
- a shielding mechanism configured to move a shielding member into between the anode and the substrate depending on a rotation angle of the substrate holder, wherein
- the shielding mechanism includes:
- a cam member;
- a rotation drive mechanism configured to rotate the cam member;
- and
- a driven member configured to push out the shielding member to a shielding position between the anode and the substrate in association with a rotation of the cam member.
8 more elements
A plating apparatus comprising:
- a plating tank for housing a plating solution;
- an anode arranged in the plating tank;
- a substrate holder for holding a substrate with a surface to be plated facing downward;
- a rotation mechanism for rotating the substrate holder;
- and
- a shielding mechanism configured to move a shielding member into between the anode and the substrate depending on a rotation angle of the substrate holder, wherein
- the shielding mechanism includes a linear motion drive mechanism configured to linearly move the shielding member between a shielding position and a retracted position, the shielding position being between the anode and the substrate, the retracted position being apart from between the anode and the substrate.
4 more elements
A plating apparatus comprising:
- a plating tank for housing a plating solution;
- an anode arranged in the plating tank;
- a substrate holder for holding a substrate with a surface to be plated facing downward;
- a rotation mechanism for rotating the substrate holder;
- a film thickness sensor configured to measure a plating film thickness of the substrate;
- and
- a shielding mechanism configured to move a shielding member to a shielding position between the anode and the substrate based on a plating film thickness of the substrate measured by the film thickness sensor.
4 more elements
A plating method comprising:
- a lowering step of lowering a substrate holder holding a substrate into a plating tank with a surface to be plated facing downward;
- a rotating step of rotating the substrate holder;
- a measuring step of measuring a plating film thickness of the substrate;
- a shielding step of moving a shielding member into between an anode and the substrate based on the plating film thickness of the substrate measured by the measuring step;
- and
- a plating step of performing a plating process on the surface to be plated by applying a voltage between the anode arranged in the plating tank and the substrate held by the substrate holder.
3 more elements
A plating apparatus comprising:
- a plating tank for housing a plating solution;
- an anode arranged in the plating tank;
- a substrate holder for holding a substrate with a surface to be plated facing downward;
- a rotation mechanism for rotating the substrate holder;
- and
- a shielding mechanism configured to move a shielding member into between the anode and the substrate depending on a rotation angle of the substrate holder, wherein
- the shielding mechanism includes:
- a cam member attached to the substrate holder;
- and
- a driven link configured to push out the shielding member into between the anode and the substrate in response to pushing by a protrusion of the cam member.
7 more elements
A plating method comprising:
- a lowering step of lowering a substrate holder holding a substrate with a surface to be plated facing downward into a plating tank;
- a rotating step of rotating the substrate holder;
- a shielding step of moving a shielding member into between an anode and the substrate depending on a rotation angle of the substrate holder by the rotating step;
- and
- a plating step of performing a plating process on the surface to be plated by applying a voltage between the anode arranged in the plating tank and the substrate held by the substrate holder, wherein
- the shielding step includes
- a step of moving a follower to a direction moving away from the substrate holder by a protrusion of a disc cam attached to the substrate holder, and a step of pushing out the shielding member into between the anode and the substrate by rotating a link in response to pushing by the follower.
4 more elements
Dependencies are inferred from the claim text.