Electroplating shield device and methods of fabricating the same

Abstract

An electroplating device includes a conduit extending from a first end to a second end. The conduit is configured to house an object for electroplating. A first set of apertures is formed on a surface of the conduit. Each of the first set of apertures has a first size. A second set of apertures is formed on the surface of the conduit adjacent the first set of apertures. Each of the second set of apertures has a second size. The first set of apertures are configured to be in alignment with a first continuous section of the object and transfer fluid to the first continuous section of the object at a first rate. The second set of apertures are configured to be in alignment with a second continuous section of the object and transfer fluid to the second continuous section of the object at a second rate.

Dependencies are inferred from the claim text.