Heat treatment apparatus heating substrate
AssigneeSCREEN Holdings Co., Ltd.
InventorsYasuaki KONDO, Mao OMORI
Life of this patent
Estimating the term…
Abstract
A combustion-supporting gas line, a flammable gas line, and an inert gas line are connected to a chamber performing a heat treatment on a semiconductor wafer. Nitrogen is sent from the inert gas line to the combustion-supporting gas line before supplying flammable gas into the chamber to replace gas in the combustion-supporting gas line with nitrogen. Nitrogen is sent from the inert gas line to the flammable gas line before supplying combustion-supporting gas into the chamber to replace gas in the flammable gas line with nitrogen. Common one inert gas line is provided in the combustion-supporting gas line and the flammable gas line, thus a space for arranging components relating to gas supply can be reduced.
Claims8
A heat treatment apparatus heating a substrate, comprising:
- a chamber housing a substrate;
- a heating part performing a heat treatment on the substrate housed in the chamber;
- a combustion-supporting gas line supplying combustion-supporting gas to the chamber;
- a flammable gas line supplying flammable gas to the chamber;
- and
- an inert gas line sending inert gas to the combustion-supporting gas line to replace gas in the combustion-supporting gas line with the inert gas and sending inert gas to the flammable gas line to replace gas in the flammable gas line with the inert gas, wherein the inert gas line is provided in the combustion-gas line and the flammable gas line in common.
Dependencies are inferred from the claim text.