Adhesive composition, cured product, and composite
AssigneeThreebond Co., Ltd.
InventorNaoya OTSUKI
Life of this patent
Estimating the term…
Abstract
An object of the present invention is to provide an adhesive composition that causes less warpage when dissimilar materials are bonded together, and has excellent adhesive strength. The present invention relates to an adhesive composition comprising a component (A) that is a monofunctional epoxy resin, a component (B) that is a polyfunctional radically polymerizable compound, a component (C) that is a curing agent, and a component (D) that is a thermal radical initiator, the component (C) being one or more selected from the group consisting of a component (c-1) that is an epoxy adduct-type latent curing agent, a component (c-2) that is a hydrazide compound, a component (c-3) that is a cyclic amidine salt, and a component (c-4) that is a thermal cationic polymerization initiator.
Claims15
An adhesive composition comprising:
- a component (A) that is a monofunctional epoxy resin;
- a component (B) that is a polyfunctional radically polymerizable compound;
- a component (C) that is a curing agent;
- and
- a component (D) that is a thermal radical initiator,
- the component (C) being one or more selected from the group consisting of a component (c-1) that is an epoxy adduct-type latent curing agent, a component (c-2) that is a hydrazide compound, a component (c-3) that is a cyclic amidine salt, and a component (c-4) that is a thermal cationic polymerization initiator.
Dependencies are inferred from the claim text.