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US 2022/0177728 A1Published application
Polishing slurry and method of manufacturing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsKenji TAKAI, Eigo MIYAZAKI, Do Yoon KIM
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Abstract
A polishing slurry including a hydrophilic nanocarbon particle having a nitrogen-containing functional group, and a weight ratio of a nitrogen element relative to a carbon element of the hydrophilic nanocarbon particle, the weight ratio expressed as N/C×100% is greater than or equal to about 5 wt %, and a method of manufacturing a semiconductor device using the polishing slurry.
Claims2
A polishing slurry comprising a hydrophilic nanocarbon particle having a nitrogen-containing functional group,
- wherein a weight ratio of a nitrogen element relative to a carbon element of the hydrophilic nanocarbon particle expressed as N/C×100% is greater than or equal to about 5 wt %.
-25. (canceled)
Dependencies are inferred from the claim text.