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US 2022/0177376 A1Published application
Silicon nitride sintered body, method for producing same, multilayer body and power module
AssigneeDenka Company Limited
InventorsShoji IWAKIRI, Makoto TAKEDA, Shinichi TAKADA
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Abstract
Provided is a method for producing a silicon nitride sintered body including: a step of molding and firing a raw material powder containing silicon nitride, in which an α-conversion rate of the silicon nitride contained in the raw material powder is less than or equal to 30 mass %. A thermal conductivity (at 20° C.) of the silicon nitride sintered body exceeds 100 W/m·K and a fracture toughness (KIC) is greater than or equal to 7.4 MPa·m1/2.
Claims12
A method for producing a silicon nitride sintered body, the method comprising:
- a step of molding and firing a raw material powder containing silicon nitride,
- wherein an α-conversion rate of the silicon nitride contained in the raw material powder is less than or equal to 30 mass %.
A silicon nitride sintered body,
- wherein a thermal conductivity (at 20° C.) exceeds 100 W/m·K and a fracture toughness (KIC) is greater than or equal to 7.4 MPa·m1/2.
Dependencies are inferred from the claim text.