Adhesion promoting layer, method for depositing conductive layer on inorganic or organic-inorganic hybrid substrate, and conductive structure

A method for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate, comprising:

• coating an adhesion promoting material on the inorganic or organic-inorganic hybrid substrate;
• performing a heat treatment to transform the crystalline phase of the adhesion promoting material to form an adhesion promoting layer, wherein the adhesion promoting layer comprises a metal oxide layer and an interface layer, the interface layer is formed on the inorganic or organic-inorganic hybrid substrate, and the metal oxide layer is formed on the interface layer;
• and
• performing a wet deposition process to form a conductive layer on the adhesion promoting layer,
• wherein the metal oxide layer comprises a metal oxide and a chelating agent, and the interface layer comprises the metal oxide, the chelating agent and metal-nonmetal-oxide composite material.

A conductive structure, comprising:

• an inorganic or organic-inorganic hybrid substrate;
• an adhesion promoting layer, disposed on the inorganic or organic-inorganic hybrid substrate;
• and
• a conductive layer, disposed on the adhesion promoting layer,
• wherein the adhesion promoting layer comprises:
• a metal oxide layer, disposed on the inorganic or organic-inorganic hybrid substrate;
• and
• an interface layer, disposed between the metal oxide layer and the inorganic or organic-inorganic hybrid substrate,
• wherein the metal oxide layer comprises a metal oxide and a chelating agent, and the interface layer comprises the metal oxide, the chelating agent and metal-nonmetal-oxide composite material.