Acoustic transducer assembly
AssigneeKnowles Electronics, LLC
InventorsJoshua Watson, Adam Ariffin
Life of this patent
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Abstract
The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.
Claims20
A microelectromechanical systems (MEMS) acoustic transducer assembly comprising:
- a base having a host-device interface with a plurality of contacts;
- a composite lid mounted on the base to form a housing, the lid having a structural core between an inner metal skin and an outer metal skin, the structural core more electrically insulating and less thermally conductive than the inner and outer metal skins;
- a MEMS transduction element disposed in the housing and acoustically coupled to a sound port of the housing;
- and
- an integrated circuit disposed in the housing, the integrated circuit electrically coupled to the MEMS transduction element and to contacts of the host-device interface
- wherein the structural core has a predetermined thickness between the inner skin and the outer skin, where the predetermined thickness is less than a predetermined spacing between the inner skin and the outer skin.
(canceled)
Dependencies are inferred from the claim text.