Tape layup apparatus and tape layup method
AssigneesToray Engineering Co., Ltd., Tokyo Institute of Technology
InventorsNaoyuki ATSUTA, Takashi IWADE, Jun INAGAKI, Toshifumi TAKEGAMI, Kotaro TADANO
Life of this patent
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Abstract
A tape layup apparatus whereby the tape layup performance on a surface to be laid up can be enhanced is provided, the tape layup apparatus being an ATL apparatus 10 having an ATL head 20 for laying up with pressing a tape 1 on a laid-up surface 2a, the ATL head 20 equipped with a pressing part 30 to press the tape 1 on the laid-up surface 2a and a parallel linkage 40 to operate in a manner that allows a pressing position and/or a pressing attitude of the pressing part 30 to follow a form of the laid-up surface 2a.
Claims19
A tape layup apparatus comprising a layup head for laying up with pressing a tape on a surface to be laid up, the layup head comprising:
- a pressing part to press the tape on the surface to be laid up;
- and
- a parallel linkage to operate in a manner that allows a pressing position and/or a pressing attitude of the pressing part to follow a form of the surface to be laid up.
Dependencies are inferred from the claim text.