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US 2022/0176629 A1Published application
3d build platform refill opening and cap
AssigneeHewlett-Packard Development Company, L.P.
InventorsMarius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
Life of this patent
Estimating the term…
Abstract
In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
Claims20
An apparatus, comprising:
- a build platform having a build material storage unit;
- an opening formed on a top surface of the build platform and over the build material storage unit, wherein the opening is to receive a hose to fill the build material storage unit;
- and
- a cap to seal the opening, when the cap is inserted into the opening.
1 more element
An apparatus, comprising:
- a build platform for a 3D printer;
- an enclosed build material storage below the build platform;
- and
- an opening in a top surface of the build platform that provides access to the enclosed build material storage, wherein the opening comprises:
- a hose valve opening mechanism coupled to a bottom ring for opening a valve on a supply hose that rests against the bottom ring.
2 more elements
A method, comprising:
- removing a cap from an opening in a top surface of a three dimensional (3D) build platform;
- supplying build material into an enclosed build material storage below the 3D platform at a maximum rate without a pouring speed control via a supply hose inserted into the opening;
- and
- replacing the cap into the opening in the top surface of the 3D build platform after the supplying the build material is completed and the supply hose is removed from the opening.
1 more element
Dependencies are inferred from the claim text.