Method for processing electronic/electrical device component scraps
AssigneeJX Nippon Mining & Metals Corporation
InventorsKatsushi AOKI, Hidetoshi SASAOKA
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Abstract
Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.
Claims6
A method for processing electronic and electrical device component scraps, comprising separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.
Dependencies are inferred from the claim text.