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US 2022/0173723 A1Published application
Single substrate multiplexer
AssigneeRf360 Europe GmbH
InventorsFlorian HABEL, Thomas BAUER, Peter HAGN, Thomas DENGLER
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Abstract
At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.
Claims11
A multiplexer, comprising
- a monolithic stack (ST) of:
- a carrier substrate (SU);
- a piezoelectric layer (PL) above the substrate having a main surface;
- and
- at least one dielectric layer (DL) arranged between piezoelectric layer and substrate;
- a metallization on top of the main surface comprising:
- an antenna terminal (AT) for connection with an antenna;
- three signal pads (SP);
- and
- three SAW filter circuits (FC) connected in parallel between the antenna terminal and a respective signal pad each, wherein each of the filter circuits comprises series signal line (SSL) and a number of SAW resonators (RP,RS) connected in series with or parallel to the series signal line;
- and
- a package providing a cavity on top of the stack, wherein the SAW resonators are enclosed in the cavity that is formed between the main surface of the piezoelectric layer and a lid and/or a cover.
9 more elements
Dependencies are inferred from the claim text.