Structure and mechanism for electrically-connecting an external-conductor

Abstract

The present disclosure relates to a structure for electrically-connecting an external conductor. The structure comprises a wiring-substrate comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers and insulating layer. A rivet is supported from the wiring substrate and comprises an embedded portion within the wiring substrate. The embedded portion comprises: an upper section extending through the stack of the plurality of layers, and, a bottom section extending laterally with reference to the upper section. A portion protruding from wiring substrate is provided for receiving an external-conductor and for thereby electrically connecting with the wiring substrate.

Dependencies are inferred from the claim text.