Defective Soldering Point Intensive Extent Analysis System For Solder Paste Inspection And Method Thereof

A defective soldering point intensive extent analysis system for a solder paste inspection, wherein the solder paste inspection is configured to immediately detect a circuit board to generate a detection log after the circuit board is set with soldering paste, the detection log comprises information of defective soldering points of the detected circuit board, the solder paste inspection stores soldering pad information corresponding to the detected circuit board, the soldering pad information comprises information of soldering point set areas, and the defective soldering point intensive extent analysis system comprises:

• a receiving module configured to receive the detection log and the soldering pad information from the solder paste inspection;
• an intensive extent analysis module configured to select one of the defective soldering points in the detection log as a center in sequential order, and use a preset aggregate radius as a determination range to determine whether the number of the defective soldering points within the determination range is higher than or equal to a preset number;
• an aggregate module configured to set the defective soldering points corresponding to the determination ranges as the same aggregate to find at least one defective soldering point area when the number of the defective soldering points within the determination range is higher than or equal to the preset number and the determination ranges have overlapped portions formed therebetween;
• a generation module configured to generate defective soldering point alert information according to statistics of the information of defective soldering points within the at least one defective soldering point area, a location and a size of the at least one defective soldering point area, and the soldering pad information;
• and
• a display module configured to display the defective soldering point alert information in a table.