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US 2022/0161547 A1Published application
Method for Stencil Printing a Layer and Printing Device
AssigneeSiemens Aktiengesellschaft
InventorsRuth Männer, Carsten Schuh, Roman Karmazin
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Abstract
Various embodiments of the teachings herein include a method for stencil printing a layer on or onto a printing surface with a stencil comprising applying a stencil with a first part and a second part to the printing surface and applying a layer of material to the printing surface through the stencil. The first part and the second part cover a non-continuous region of the printing surface.
Claims10
A method for stencil printing a layer on or onto a printing surface with a stencil, the method comprising:
- applying a stencil with a first part and a second part to the printing surface;
- wherein the first part and the second part cover a non-continuous region of the printing surface;
- and
- applying a layer of material to the printing surface through the stencil.
1 more element
A printing device comprising:
- a printing surface;
- a printing head;
- a printing frame which can be placed between the printing surface and printing head;
- and
- a stencil with a first part and a arranged so a non-continuous region of the printing surface can be covered with the first part and the second part;
- and
- wherein the first part is arranged on a printing frame and the second part is arranged on a printing surface.
4 more elements
Dependencies are inferred from the claim text.