Thermosetting resin composition, thermosetting resin film, thermoset film, multilayer body, printed wiring board and method for producing same
AssigneeKaneka Corporation
InventorsFumiya Kono, Masayoshi Kido
Life of this patent
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Abstract
A thermosetting resin composition comprises a component (A) that is a compound having an imide group and a carboxy group in one molecule, and a component (B) that is a polymer having a repeating unit represented by the following general formula (1). R1 and R2 in formula (1) are each independently a hydrogen atom or a methyl group. R3 in formula (1) is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure. R4 in formula (1) is a hydrogen atom or an alkyl group. m and n in formula (1) are each independently an integer of 1 or more, and m/n may be 1 to 50.
Claims19
A thermosetting resin composition comprising:
- a component (A) that is a compound having an imide group and a carboxy group in one molecule;
- and
- a component (B) that is a polymer having a repeating unit represented by the following general formula (1):
- wherein in the general formula (1), R1 and R2 are each independently a hydrogen atom or a methyl group;
- R3 is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure;
- R4 is a hydrogen atom or an alkyl group;
- and m and n are each independently an integer of 1 or more, and min is 1 to 50.
Dependencies are inferred from the claim text.