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US 2022/0152649 A1Published application
An alloy injection molded liquid metal substrate
AssigneeHewlett-Packard Development Company, L.P.
InventorsChi Hao Chang, Ya-Ting Yeh, Chih-Hsiung Liao, Kuan-Ting Wu
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Abstract
Examples of an alloy injection molded liquid metal substrate are described. In an example, an alloy injection molded liquid metal substrate includes a liquid metal substrate and an alloy injection molded on a first surface of the liquid metal substrate.
Claims15
An alloy injection molded liquid metal substrate comprising:
- a liquid metal substrate;
- and
- an alloy injection molded on a first surface of the liquid metal substrate.
An enclosure for an electronic device comprising:
- a liquid metal substrate;
- a magnesium alloy injection molded onto a portion of a surface of the liquid metal substrate;
- and
- a decorative layer deposited on the magnesium alloy injection molded liquid metal substrate.
1 more element
A method for fabricating an alloy injection molded liquid metal substrate, the method comprising:
- injection molding a magnesium alloy onto a portion of a surface of a liquid metal substrate at a temperature from about 800° C. to about 1300° C.
Dependencies are inferred from the claim text.