Switch device and method for producing switch device
AssigneeOMRON Corporation
InventorsKenji KUROKI, Kenji SHINOHARA
Life of this patent
Estimating the term…
Abstract
A switch device includes a plurality of lead frames that is conductive and configured to electrically connectable to an external device, a contact-separation mechanism configured to allow the plurality of lead frames to be electrically connected to and separated from each other, and an electric element configured to connect the plurality of lead frames to each other. The electric element is surface-mounted on the lead frames and sealed with resin. In each of the lead frame, the boundary, such as a groove or a notch, is formed along the outer edge of the arrangement position of the electric element.
Claims11
A switch device comprising:
- a plurality of lead frames that is conductive and configured to be electrically connectable to an external device;
- a contact-separation mechanism configured to allow the plurality of lead frames to be electrically connected to and separated from each other;
- and
- an electric element configured to connect the plurality of lead frames to each other,
- wherein the electric element
- is surface-mounted on the plurality of lead frames, and
- is sealed with resin.
A method for manufacturing a switch device including a plurality of lead frames that is conductive and configured to be electrically connectable to an external device, a contact-separation mechanism configured to allow the plurality of lead frames to be electrically connected to and separated from each other, and an electric element configured to connect the plurality of lead frames to each other, the method comprising:
- forming the lead frames from a conductive plate;
- placing the electric element on the plurality of lead frames;
- sealing, with resin, the electric element and, thus, forming a mold body;
- and
- of assembling components comprising the contact-separation mechanism and the mold body.
Dependencies are inferred from the claim text.