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US 2022/0144741 A1Published application
Compound and composition
AssigneeKao Corporation
InventorsShogo KAMENOUE, Takashi MIZOOKU, Ryuya ARATA, Akiyoshi KIMURA
Life of this patent
Estimating the term…
Abstract
The present invention provides: a compound that has a low melting point and is capable of forming a film of high hydrophobicity, and a composition containing this compound. The compound of the present invention is represented by chemical formula (1). (In the formula, R1 and R2 are each a C1-C33 aliphatic hydrocarbon group, the total number of carbons of in R1 and R2 is 14-34, X is a single bond or a C1-C5 aliphatic hydrocarbon group, and A is —O—CH2—CH(OH)—CH2OH or —O—CH(—CH2—OH)2.)
Claims20
A compound represented by a Chemical Formula (1):
- wherein R1 and R2 are each an aliphatic hydrocarbon group having 1 or more and 33 or less carbon atoms, a total number of carbon atoms of R1 and R2 is 14 or more and 34 or less, X is a single bond or an aliphatic hydrocarbon group having 1 or more and 5 or less carbon atoms, and A is —O—CH2—CH(OH)—CH2OH or —O—CH(—CH2—OH)2.
Dependencies are inferred from the claim text.