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AssigneeToyobo Co., Ltd.
InventorsMasahiro YAMASHITA, Kaya TOKUDA, Tetsuo OKUYAMA
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The present invention enables the achievement of a laminate of heat-resistant polymer films, which does not use a bonding material having inferior heat resistance. According to the present invention, a polyvalent amine compound serving as a reactive compound is applied to heat-resistant polymer films such as PET, PEN or PI films, and the resulting polymer films are superposed upon each other and subsequently subjected to a heat treatment under predetermined conditions, thereby obtaining a laminate of heat-resistant polymer films. Since the thus-obtained laminate does not use a bonding material, the heat resistance is not decreased and the film properties before lamination are not deteriorated. Since the process for obtaining this laminate has excellent productivity, this laminate is useful as a low-cost thick heat-resistant polymer film or sheet of high performance.
A heat-resistant polymer film laminate comprising a structure in which at least two heat-resistant polymer films are laminated, wherein there is an amide bond derived from an organic compound having two or more amino groups and a boiling point of 250° C. or less at a laminated interface of the two heat-resistant polymer films.
A method for producing a heat-resistant polymer film laminate having a structure in which at least two heat-resistant polymer films are laminated, the method comprising at least:
Dependencies are inferred from the claim text.