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US 2022/0139630 A1Published application
Ceramic electronic device and manufacturing method of the same
AssigneeTaiyo Yuden Co., Ltd.
InventorsKazuki YAMADA, Kotaro MIZUNO, Yoichi KATO, Hidetoshi MASUDA
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Abstract
A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.
Claims8
A ceramic electronic device comprising:
- a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked,
- wherein the plurality of internal electrode layers include Ni, Sn and Au.
A manufacturing method of a ceramic electronic device comprising:
- forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au;
- forming a multilayer structure by stacking the each of stack units;
- and
- firing the multilayer structure.
1 more element
Dependencies are inferred from the claim text.