Film-closure apparatus for plastic film material, printed circuit board, and method of enhancing the operation of a film-closure apparatus
AssigneeGreen Light Packaging Limited
InventorMark Bonning
Life of this patent
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Abstract
A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.
Claims22
A film-closure apparatus for closing plastic film material using heat, the film-closure apparatus comprising:
- a guide path along which at least part of a plastics film material can pass;
- a drive motor or similar means for moving the film material along the guide path;
- and
- a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface;
- and
- the electrically conductive heating element being positionable on the guide path to apply heat to the film material thereon.
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A method of enhancing the operation of a film-closure apparatus, the method comprising the steps of:
- a] determining a voltage or current of an existing power supply of the film-closure apparatus and a required sealing temperature;
- b] providing a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface;
- and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface;
- c] removing an existing heating element of the film-closure apparatus;
- and
- d] installing the printed circuit board into the film-closure apparatus in communication with the existing power supply, such that electrically conductive heating element outputs the required sealing temperature.
A set of printed circuit boards, each printed circuit board comprising:
- a circuit substrate having first and second major board surfaces and a perimeter edge surface;
- and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface, wherein each printed circuit boards includes an extended resistance track of different resistance, each printed circuit board having a different heating temperature achievable by its heating element for a given voltage and/or current of a power supply of a film-closure apparatus.
Dependencies are inferred from the claim text.