# US 2022/0132678 A1 · System and method for high-temperature lamination of printed circuit boards > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0132678 A1 - Document ID: US20220132678A1 - Status: Published application - Kind: A1 - Application number: 17/177,733 - Filed: 2021-02-17 - Published: 2022-04-28 - Earliest claimed: 2020-10-28 - Assignees: Matrix Electronics Limited - Applicants: Matrix Electronics Limited - Inventors: Kieran HEALY - Web page: https://patentgrep.com/patent/US20220132678A1 ## CPC - H05K 3/4635: {laminating flexible circuit boards using additional insulating adhesive materials between the boards} - B32B 37/12: characterised by using adhesives - B32B 37/26: with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers - B30B 15/061: {Cushion plates} - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 27/10: of paper or cardboard - B32B 27/12: next to a fibrous or filamentary layer - B32B 27/281: {comprising polyimides} - B32B 37/003: {to avoid air inclusion} - B32B 37/226: {Laminating sheets, panels or inserts between two continuous plastic layers} - B32B 38/162: {Cleaning} - B32B 2037/268: {Release layers} - H05K 2201/0154: Polyimide - H05K 2203/068: Features of the lamination press or of the lamination process, e.g. using special separator sheets - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - B30B: PRESSES IN GENERAL (producing ultra-high pressure or ultra-high pressure and high temperature to effect modifications of a substance, e.g. for making artificial diamonds B01J3/00 ){(compressing means for refuse receptacles B65F1/1405)} ## Abstract A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate. ## Claims ### Claim 1 A press pad for use in lamination of multi-layer circuit boards, the press pad comprising: a planar pad having a first surface and a second surface opposite to the first surface; a sheet of release film coupled to the first surface, wherein the release film sheet is coupled to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate, and wherein the release film sheet comprises polyimide-based film. ### Claim 2 (depends on 1) The press pad of claim 1, wherein the planar pad is constructed of at least one of paper or cotton. ### Claim 3 (depends on 1) The press pad of claim 1, wherein a thickness of each release film sheet is between 0.003 and 0.01 inch. ### Claim 4 (depends on 1) The press pad of claim 1, wherein the acrylic-based adhesive forms an adhesive layer coupling the release film sheet to the first surface, and wherein a thickness of the adhesive layer is between 5 and 15 microns. ### Claim 5 (depends on 1) The press pad of claim 1, wherein a thickness of the planar pad is between 0.05 and 0.06 inch. ### Claim 6 (depends on 1) The press pad of claim 1, wherein the release film sheet comprises a polyimide-based film containing polytetrafluoroethylene filler particles. ### Claim 7 A method of manufacturing a press pad, the method comprising: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate. ### Claim 8 (depends on 7) The method of claim 7, wherein the cleaning includes applying a stream of neutrally charged air over portions of surfaces of the planar pad. ### Claim 9 (depends on 7) The method of claim 7, further comprising cleaning the release film sheet. ### Claim 10 (depends on 9) The method of claim 9, wherein cleaning the release film sheet includes passing the release film sheet over one or more adhesive take-up rollers, the adhesive take-up roller having a tack for removing debris. ### Claim 11 (depends on 7) The method of claim 7, wherein the adhesive take-up roller is a silicon roller. ### Claim 12 (depends on 7) The method of claim 7, further comprising thermally treating the release film sheet along its length. ### Claim 13 (depends on 7) The method of claim 7, further comprising driving the press pad between a pair of curl elimination guides. ### Claim 14 A system for manufacturing a press pad, the system comprising: a first material handling unit for receiving a planar pad; a second material handling unit for receiving a release film sheet, the release film sheet having an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate applied to one side; and at least one roller coupled with a drive, the drive rotating the roller to pull the release film sheet into contact with the planar pad to attach the release film sheet to a first surface of the planar pad. ### Claim 15 (depends on 14) The system of claim 14, further comprising an air curtain for applying a stream of neutrally charged air over portions of the press pad. ### Claim 16 (depends on 14) The system of claim 14, further comprising a chamber through which the planar pad is pulled, the chamber containing one or more electrostatic bars for removing particulates from surfaces of the planar pad. ### Claim 17 (depends on 14) The system of claim 14, wherein the chamber includes, in its interior, an air knife for blowing off removed particulates from the surfaces of the planar pad. ### Claim 18 (depends on 14) The system of claim 14, further comprising a pair of curl elimination guides between which the press pad is pulled. ### Claim 19 (depends on 18) The system of claim 18, further comprising de-curl rollers for driving the press pad between the curl elimination guides. ### Claim 20 (depends on 14) The system of claim 14, further comprising a punch and die apparatus for punching holes patterns in the press pad.