US 2022/0130620 A1 · METHOD FOR PRODUCING A PLATE ARRANGEMENT

Abstract

The invention relates to a method of producing a plate arrangement comprising two plates (1, 2) which, at least in sections, have an intermediate space (4) located between them and a constant distance (d) to one another and/or are arranged parallel to one another and between which a fusible solder material (3, 3′) is arranged. The task of setting a defined distance between the plates as accurately as possible is solved according to the invention by creating a pressure difference between the intermediate space (4) between the plates and the outer space surrounding the plates in such a way that the pressure in the outer space is higher than in the intermediate space (4) and that the temperature of the solder material (3, 3′) is at least temporarily raised above its melting temperature during the existence of the pressure difference.

Claims20

Dependent claims

A method for producing a plate arrangement, the method comprising:

locating a first plate and a second plate parallel to each other or, at least in sections, a constant distance from each other, wherein an intermediate space is included, at least in sections, between the first plate and the second plate;
joining the first plate and the second plate, wherein the joining includes:
locating a fusible solder material in at least a portion of the intermediate space;
producing a pressure difference between the intermediate space and an outer space surrounding the first plate and the second plate such that a pressure in the outer space is greater than a pressure in the intermediate space;
and
raising a temperature of the fusible solder material above at least one of a melting temperature or a bonding temperature of the fusible solder material during the pressure difference.

3 more elements

Dependencies are inferred from the claim text.

Method for producing a plate arrangement

Life of this patent

Method for producing a plate arrangement

Life of this patent

Abstract

Claims20