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US 2022/0128768 A1Published application
Optical device package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHuang-Hsien CHANG, Po Ju WU, Yu Cheng CHEN, Wen-Long LU
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Abstract
An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.
Claims20
An optical device package, comprising:
- a semiconductor substrate having a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface, wherein a surface roughness of the profile is greater than a surface roughness of the second surface.
An optical device package, comprising:
- a carrier defining a recess, wherein a sidewall of the recess includes a plurality of concaves with substantially uniform shapes.
An optical device package, comprising:
- a carrier defining a space recessed from an upper surface, wherein the space includes a bottom surface and a sidewall connecting the upper surface and the bottom surface;
- and
- an optical device disposed in the space;
- wherein the bottom surface has a curved shape fitting in a portion of a contour of the optical device.
1 more element
Dependencies are inferred from the claim text.