Heat dissipation plate and method for manufacturing the same
AssigneeCooler Master Co., Ltd.
InventorsWei-Lung CHAN, Wen-Ti CHENG
Life of this patent
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AssigneeCooler Master Co., Ltd.
InventorsWei-Lung CHAN, Wen-Ti CHENG
Estimating the term…
A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.
A heat dissipation device, comprising:
A heat dissipation device, comprising:
Dependencies are inferred from the claim text.