# US 2022/0126479 A1 · System and method for lamination of printed circuit boards

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- Number: US 2022/0126479 A1
- Document ID: US20220126479A1
- Status: Published application
- Kind: A1
- Application number: 17/082,091
- Filed: 2020-10-28
- Published: 2022-04-28
- Earliest claimed: 2020-10-28
- Assignees: Matrix Electronics Limited
- Applicants: Matrix Electronics Limited
- Inventors: Kieran HEALY
- Web page: https://patentgrep.com/patent/US20220126479A1

## CPC

- B32B 37/1207: {Heat-activated adhesive (B32B37/04 takes precedence)}
- B32B 38/162: {Cleaning}
- B30B 15/061: {Cushion plates}
- B32B 5/02: characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)}
- B32B 7/06: permitting easy separation
- B32B 29/00: Layered products comprising {a layer of} paper or cardboard
- H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 27/10: of paper or cardboard
- B32B 27/12: next to a fibrous or filamentary layer
- B32B 27/281: {comprising polyimides}
- B32B 37/1284: {Application of adhesive}
- B32B 37/226: {Laminating sheets, panels or inserts between two continuous plastic layers}
- B32B 38/10: Removing layers, or parts of layers, mechanically or chemically
- B32B 2250/40: Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/26: Polymeric coating
- B32B 2262/062: Cellulose fibres, e.g. cotton
- B32B 2307/732: Dimensional properties
- B32B 2457/08: PCBs, i.e. printed circuit boards
- B32B 2571/00: Protective equipment
- H05K 2203/068: Features of the lamination press or of the lamination process, e.g. using special separator sheets
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B30B: PRESSES IN GENERAL (producing ultra-high pressure or ultra-high pressure and high temperature to effect modifications of a substance, e.g. for making artificial diamonds B01J3/00 ){(compressing means for refuse receptacles B65F1/1405)}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface; cleaning the planar pad, the cleaning including electrostatically removing particulates from the first and second surfaces of the planar pad; and attaching a first release film sheet to the first surface and a second release film sheet to the second surface, the release film sheets being attached to the first and second surfaces using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

## Claims

### Claim 1

A press pad for use in lamination of multi-layer circuit boards, the press pad comprising:
a planar pad having a first surface and a second surface opposite to the first surface;
a first sheet of release film coupled to the first surface; and
a second sheet of release film coupled to the second surface,
wherein the first and second release film sheets are coupled to the first and second surfaces, respectively, using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate, and wherein each of the first and second release film sheets comprises polyimide-based film.

### Claim 2 (depends on 1)

The press pad of claim 1, wherein the planar pad is constructed of at least one of paper or cotton.

### Claim 3 (depends on 1)

The press pad of claim 1, wherein a thickness of each release film sheet is between 0.003 and 0.01 inch.

### Claim 4 (depends on 1)

The press pad of claim 1, wherein the acrylic-based adhesive forms a first adhesive layer coupling the first release film sheet to the first surface and a second adhesive layer coupling the second release film sheet to the second surface, and wherein a thickness of each of the first and second adhesive layers is between 5 and 15 microns.

### Claim 5 (depends on 1)

The press pad of claim 1, wherein a thickness of the planar pad is between 0.05 and 0.06 inch.

### Claim 6 (depends on 1)

The press pad of claim 1, wherein the first and second release film sheets are permanently bonded to the first and second surfaces, respectively, using the acrylic-based adhesive.

### Claim 7

A method of manufacturing a press pad, the method comprising:
providing a planar pad having a first surface and a second surface opposite to the first surface, a first release film sheet, and a second release film sheet, each of the first and second release film sheets including a polyimide-based film;
cleaning the planar pad, the cleaning including electrostatically removing particulates from the first and second surfaces of the planar pad; and
attaching the first release film sheet to the first surface and the second release film sheet to the second surface, the release film sheets being attached to the first and second surfaces using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

### Claim 8 (depends on 7)

The method of claim 7, wherein the cleaning includes applying a stream of neutrally charged air over portions of one or both of the first and second surfaces of the planar pad.

### Claim 9 (depends on 7)

The method of claim 7, further comprising cleaning the first and second release film sheets.

### Claim 10 (depends on 9)

The method of claim 9, wherein cleaning the first and second release film sheets includes passing the release film sheets over one or more adhesive take-up rollers, the adhesive take-up roller having a tack for removing debris.

### Claim 11 (depends on 7)

The method of claim 7, wherein the adhesive take-up roller is a silicon roller.

### Claim 12 (depends on 7)

The method of claim 7, further comprising thermally treating the first release film sheet and the second release film sheet along their respective lengths.

### Claim 13 (depends on 12)

The method of claim 12, wherein the thermal treatment is adjustable to vary an amount of heat applied to the first and second release film sheets.

### Claim 14

A system for manufacturing a press pad, the system comprising:
a first material handling unit for receiving a planar pad;
a second material handling unit for receiving a first release film sheet and a second release film sheet, the release film sheets each having an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate applied to one side; and
at least one roller coupled with a drive, the drive rotating the roller to pull the first and second release film sheets into contact with the planar pad to attach the release film sheets to respective surfaces of the planar pad.

### Claim 15 (depends on 14)

The system of claim 14, further comprising an air curtain for applying a stream of neutrally charged air over portions of the press pad.

### Claim 16 (depends on 14)

The system of claim 14, further comprising a chamber through which the planar pad is pulled, the chamber containing one or more electrostatic bars for removing particulates from surfaces of the planar pad.

### Claim 17 (depends on 14)

The system of claim 14, wherein the chamber includes, in its interior, an air knife for blowing off removed particulates from the surfaces of the planar pad.

### Claim 18 (depends on 14)

The system of claim 14, wherein the chamber includes, in its interior, a take-up vacuum for collecting the removed particulates.

### Claim 19 (depends on 14)

The system of claim 14, further comprising a gripper unit for gripping the planar pad, the gripper unit containing a plurality of needles for contacting the surfaces of the planar pad.

### Claim 20 (depends on 14)

The system of claim 14, further comprising a punch and die apparatus for punching hole patterns in the press pad.