Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (ic) packages and fabrication methods

A tunable circuit package, comprising:

• a package substrate;
• a passive device coupled to the package substrate, the passive device comprising:
• an inductor comprising a first terminal and a second terminal, the first terminal coupled to a node;
• a first capacitor comprising a third terminal and a fourth terminal, the third terminal coupled to the node;
• and
• a semiconductor device coupled to the package substrate, the semiconductor device comprising a variable capacitor comprising a fifth terminal and a sixth terminal, the fifth terminal coupled to the node.

A method of manufacturing a tunable circuit package, comprising:

• forming a package substrate;
• forming a passive device comprising an inductor and a first capacitor, the inductor comprising a first terminal and a second terminal, the first terminal coupled to a node, and the first capacitor comprising a third terminal and a fourth terminal, the third terminal coupled to the node;
• forming a semiconductor device comprising a variable capacitor comprising a fifth terminal and a sixth terminal;
• coupling the passive device to the package substrate;
• and
• coupling the semiconductor device to the package substrate to couple the fifth terminal to the node.