Method for cleaning substrate, method for manufacturing photomask and method for cleaning photomask
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYU-HSIN HSU, HAO-MING CHANG, SHAO-CHI WEI, SHENG-CHANG HSU, CHENG-MING LIN
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Abstract
A method for cleaning is provided. The method includes: removing a pellicle frame from a top surface of a photomask by debonding an adhesive between the photomask and the pellicle frame, wherein a first portion of the adhesive is remained on the top surface of the photomask, and removing the first portion of the adhesive on the top surface of the photomask, including applying an alkaline solution to the top surface of the photomask, and performing a mechanical impact to the photomask.
Claims20
A method for cleaning, comprising:
- removing a pellicle frame from a top surface of a photomask by debonding an adhesive between the photomask and the pellicle frame, wherein a first portion of the adhesive is remained on the top surface of the photomask;
- and
- removing the first portion of the adhesive on the top surface of the photomask, comprising:
- applying an alkaline solution to the top surface of the photomask;
- and
- performing a mechanical impact to the photomask.
A method for cleaning a substrate, comprising:
- removing adhesive on a top surface of a photomask, comprising:
- applying ozonated deionized water over the top surface of the photomask;
- applying TMAH solution over the top surface of the photomask after applying ozonated deionized water over the top surface of the photomask for altering molecular bonding of the adhesive thereon;
- and
- performing a megasonic cleaning on the remaining adhesive, wherein a portion of the top surface of the photomask is exposed from the adhesive subsequent to the megasonic cleaning.
A method for cleaning, comprising:
- receiving a photomask, wherein a first portion of a surface of the photomask is covered by an adhesive material;
- applying an alkaline solution to the adhesive material on the surface of the photomask;
- and
- performing a mechanical impact to the photomask to remove at least a portion of the adhesive material.
Dependencies are inferred from the claim text.