Bonding adhesive and adhered roofing systems prepared using the same
AssigneeHolcim Technology Ltd
InventorsJiansheng TANG, Joseph CARR
Life of this patent
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Abstract
A method is provided for forming an adhered membrane roof system that meets Factory Mutual (FM) 4470/4474 standards for wind uplift. The method comprises applying a bond adhesive to a substrate on a roof to form an adhesive layer and applying a membrane directly to the adhesive layer. The bond adhesive includes a moisture-curable polymer.
Claims13
A method for forming an adhered membrane roof system that meets FM 4470/4474 standards for wind uplift, the method comprising:
- (i) applying a bond adhesive to a substrate on a roof to form an adhesive layer having a thickness of at least 5 mils and less than 30 mils, where the bond adhesive includes a silyl-terminated polymer and a hydrocarbon tackifier resin, and is devoid of phenolic resin;
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- (ii) applying a membrane directly to the adhesive layer, whereby a bond is formed between the substrate and the membrane that exceeds 1 pli, when measured according to ASTM D1876.
A method for forming an adhered membrane roof system that meets FM 4470/4474 standards for wind uplift, the method comprising:
- (i) applying a bond adhesive to a substrate on a roof at an application rate of at least 50 square feet per gallon of bond adhesive, to form an adhesive layer having a thickness of at least 5 mils and less than 30 mils, where the bond adhesive includes a silyl-terminated polymer and a low VOC-generating moisture scavenger;
- and
- (ii) applying a membrane directly to the adhesive layer, whereby a bond is formed between the substrate and the membrane that exceeds 1 pli, when measured according to ASTM D1876.
A method for forming an adhered membrane roof system that meets FM 4470/4474 standards for wind uplift, the method comprising, the method comprising:
- (i) applying a bond adhesive to a substrate on a roof at an application rate of at least 50 square feet per gallon of bond adhesive, to form an adhesive layer having a thickness of at least 5 mils and less than 30 mils, where the bond adhesive includes a silyl-terminated polymer, and a non-phthalate plasticizer, and where the bond adhesive has a dynamic viscosity of less than 13,000 cPs by using a Brookfield viscometer equipped with a #6 spindle operating at room temperature and 10 rpm and a static viscosity of from about 3600 to about 24,000 cPs by using a Brookfield viscometer equipped with a #6 spindle operating at room temperature and 2 rpm;
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- (ii) applying a membrane directly to the adhesive layer, whereby a bond is formed between the substrate and the membrane that exceeds 1 pli, when measured according to ASTM D1876.
Dependencies are inferred from the claim text.