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US 2022/0111432 A1Published application
Mold cooling structure
AssigneeToyota Jidosha Kabushiki Kaisha
InventorHironori TAKASAKA
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Abstract
A mold cooling structure according to the present disclosure includes a first refrigerant flow channel through which a first refrigerant for cooling a mold flows; and a second refrigerant flow channel through which a second refrigerant for cooling the first refrigerant flowing through the first refrigerant flow channel flows. Further, the second refrigerant flow channel extends along the first refrigerant flow channel. Furthermore, mutual heat exchange between the first refrigerant and the second refrigerant is performable.
Claims4
A mold cooling structure comprising:
- a first refrigerant flow channel through which a first refrigerant for cooling a mold flows;
- and
- a second refrigerant flow channel through which a second refrigerant for cooling the first refrigerant flowing through the first refrigerant flow channel flows, wherein
- the second refrigerant flow channel extends along the first refrigerant flow channel, and
- mutual heat exchange between the first refrigerant and the second refrigerant is performable.
2 more elements
Dependencies are inferred from the claim text.