Smt process prediction tool for intelligent decision making on pcb quality

A surface mounted technology (SMT) process prediction tool for intelligent decision making on printed circuit board (PCB) quality, comprising:

• software layers of an SMT intelligent decision-making toolkit which comprises:
• a data fusion toolkit, a printing parameter decision-making toolkit,
• a soldering parameter decision-making toolkit and
• a human-computer interaction toolkit all in communication with a database,
• wherein a data fusion tool automatically reads size parameters and component information on design conditions of a printed board to be assembled from the database and creates a design condition list for different components for a software execution layer;
• the printing parameter decision-making toolkit and the soldering parameter decision-making toolkit in the software execution layer perform comparisons with historical printing and soldering data of components under conditions of different printed boards according to design conditions of components on the printed board to be assembled, mine one or more groups of data of alternative satisfactory printing parameter combinations and soldering parameter combinations for components respectively, perform automatic decision making on printing and soldering parameters with a multi-objective optimization algorithm and a deep learning algorithm, predict printing quality and soldering quality according to size parameters and component information in a printed board design document, and send the decided printing and soldering process parameters and corresponding predicted quality results to the human-computer interaction toolkit, to visually display the printing and soldering process parameters and predicted quality values.