Liquid cooling heat exchange apparatus for memory modules

A system including a liquid cooling heat exchange apparatus for memory modules, the liquid cooling heat exchange apparatus configured to be flow through by a working fluid, the system comprising:

• a circuit board of an electric or electronic device having at least one memory module slot, extending longitudinally, mutually opposing, parallel, and spaced apart, whereby a memory module is mounted in the at least one memory module slot,
• a thermal conduction assembly, configured to be mounted on the memory modules, comprising:
• a pair of flat flexible conduits, mutually opposing, parallel, and spaced apart, each, comprising at least one fluid passageway, configured to be flow through by the working fluid, having an inlet end and an outlet end, wherein each of the inlet ends and each of the outlet ends are on a same end, and the pair of flat flexible conduits is in thermal contact with the memory modules;
• a fastening assembly, comprising:
• at least one securing apparatus configured to secure the thermal conduction assembly to the memory modules;
• a first working fluid splitter, configured to contain and transport the working fluid, comprising:
• a first container body;
• a first conduit connector, extending outwardly from the first container body and in communication therewith, having a pair of first connector extensions;
• and
• a first flow through opening;
• and
• a second working fluid splitter, configured to contain and transport the working fluid, comprising:
• a second container body;
• a second conduit connector, extending outwardly from the second container body and in communication therewith, having a pair of second connector extensions;
• and
• a second flow through opening,
• wherein each of the inlet ends is mounted to the pair of first connector extensions and each of the outlet ends is mounted to the pair of second connector extensions, and working fluid travels into the first container body through the first flow through opening and out thereof through the pair of first connector extensions, and working fluid travels into the second container body through the pair of second connector extensions and out thereof through the second flow through opening, and
• whereby the pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first working fluid splitter with the second working fluid splitter for transferring heat from the heat producing chips, and wherein each of the at least one fluid passageway is expandable.