Liquid-cooling devices, and systems, to cool multi-chip modules

A cooling system for an electronic device, the cooling system comprising:

• a distribution manifold and a collection manifold;
• a plurality of cold plates, each cold plate comprising an enclosure defining a first external major surface, an opposed second external major surface, and a corresponding internal chamber positioned between the first external major surface and the second external major surface, wherein each respective internal chamber is fluidicly coupled with the distribution manifold and the collection manifold;
• a heat exchanger configured to transfer heat from a liquid coolant passing through the heat exchanger to another medium;
• and
• a pump configured to urge the liquid coolant through and among the distribution manifold, the plurality of cold plates, the collection manifold and the heat exchanger.

An electronic device, comprising:

• a multi-chip module having mounted thereto a plurality of active electronic components, wherein each active electronic component dissipates heat while operating;
• a cold plate comprising an external major surface positioned opposite the plurality of active components and defining an internal chamber,;
• a thermal interface between the external major surface of the cold plate and each in the plurality of active components;
• and
• a retainer configured to urge the external major surface of the cold plate and the plurality of active components of the multi-chip module toward each other.