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US 2022/0104389 A1Published application
Injectable heat sink
AssigneePanasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America
InventorNICHOLAS BRIAN HANSEN
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Abstract
A heat sink arrangement includes a housing associated with an electronic heat source. The housing has a cavity adjacent to the heat source. A thermally conductive, electrically insulating foam heat sink is disposed in the cavity and draws heat out of the heat source. The foam heat sink may be formed of a two-part epoxy.
Claims20
A heat sink arrangement, comprising:
- an electronic heat source;
- a housing associated with the heat source, the housing having a cavity adjacent to the heat source;
- and
- a foam heat sink disposed in the cavity and configured to draw heat out of the heat source.
1 more element
A method of removing heat from an electronic heat source that is associated with a housing having a cavity, the method comprising:
- blowing a liquid foam into the cavity;
- waiting for the liquid foam to cure into a solid or semi-solid foam inside the cavity;
- operating the electronic heat source;
- and
- using the solid or semi-solid foam in the cavity to draw heat out of the electronic heat source.
2 more elements
A heat sink arrangement, comprising:
- an electronic assembly including:
- a high-power electronic component that produces heat during operation;
- a housing containing the electronic component, the housing having a cavity;
- a first container containing a first epoxy part and a first blowing agent part;
- a second container containing a second epoxy part and a second blowing agent part;
- and
- a nozzle configured to blow a mixture of contents of the first container and contents of the second container into the cavity of the housing to thereby form a foam heat sink in the cavity for drawing heat out of the electronic component.
4 more elements
Dependencies are inferred from the claim text.