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US 2022/0104376 A1Published application
Electronic device housing, manufacturing method thereof, and electronic device
AssigneeBYD Company Limited
InventorsLan MA, Haiyan JIN, Liang CHEN
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Abstract
An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interface-free continuous connection is provided between the bottom plate and the middle frame.
Claims12
An electronic device housing, comprising:
- a bottom plate, and a middle frame connected to the bottom plate, wherein:
- the middle frame is made of glass, and the bottom plate is made of sapphire;
- or the bottom plate is made of glass, and the middle frame is made of sapphire;
- and
- a connection between the bottom plate and the middle frame is continuous and interface-free.
2 more elements
A method for manufacturing an electronic device housing, comprising:
- cleaning surfaces of components to be welded to obtain surface-cleaned components, and
- assembling, pre-pressurizing, and welding the surface-cleaned components, to make the connection between the components to be welded continuous and interface-free,
- wherein the component to be welded comprises at least a middle frame and a bottom plate, the middle frame is made of glass, and the bottom plate is made of sapphire;
- or the bottom plate is made of glass, and the middle frame is made of sapphire.
1 more element
Dependencies are inferred from the claim text.