A Method and Apparatus for Preparing a PCB Product Having Highly Dense Conductors
AssigneeOrbotech Ltd.
InventorsNava Shpaisman, Abraham Gross, Arie Glazer
Life of this patent
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Abstract
A method for preparing a PCB product having highly dense conductors, the method including providing a PCB substrate including a conductive layer, employing an inkjet printer to selectively print unexposed photosensitive patterns on the PCB substrate, the unexposed photosensitive patterns having a thickness of less than 5 pm, exposing the photosensitive patterns to radiation thereby to define exposed patterns, the exposed patterns having a pitch less than 20 pm and wet etching the conductive layer in accordance with a pattern defined by the exposed patterns thereby to define the highly dense conductors having a pitch of less than 30 pm.
Claims25
1-16. (canceled)
Apparatus for use in preparing a PCB product having highly dense conductors, the apparatus comprising:
- a common chassis;
- an inkjet printer mounted on said common chassis and being operative to selectively print unexposed photosensitive patterns on a PCB substrate, said unexposed photosensitive patterns having a thickness of less than 5 μm, wherein said unexposed photosensitive patterns are printed with a photosensitive ink comprising:
- a photoresist constituting 33-64 wt. % of said photosensitive ink;
- a solvent constituting 19.99-59.99 wt. % of said photosensitive ink;
- a humectant constituting 1-10 wt. % of said photosensitive ink;
- a surfactant constituting 0.01-0.1 wt. % of said photosensitive ink;
- an adhesion promoter constituting 1-3 wt. % of said photosensitive ink, said adhesion promoter having a molecular weight between 1700-70000 Da;
- and
- a basic solution constituting 2-3 wt. % of said photosensitive ink, said adhesion promoter being dissolved in said basic solution;
- and
- a pattern exposer mounted on said common chassis and being operative to expose said photosensitive patterns to radiation thereby to define exposed patterns, said exposed patterns having a pitch of less than 20 μm.
26-31. (canceled)
35-56. (canceled)
A photosensitive ink for use in an inkjet printer, said photosensitive ink comprising:
- a photoresist constituting 33-64 wt. % of said photosensitive ink;
- a solvent constituting 19.99-59.99 wt. % of said photosensitive ink;
- a humectant constituting 1-10 wt. % of said photosensitive ink;
- a surfactant constituting 0.01-0.1 wt. % of said photosensitive ink;
- an adhesion promoter constituting 1-3 wt. % of said photosensitive ink, said adhesion promoter having a molecular weight between 1700-70000 Da;
- and
- a basic solution constituting 2-3 wt. % of said photosensitive ink, said adhesion promoter being dissolved in said basic solution.
(canceled)
A non-oxygen permeable ink for use in an inkjet printer comprising:
- a polymer constituting 10-15 wt. % of said non-oxygen permeable ink, said polymer having a minimum molecular weight of 7000 Da;
- one or more solvents constituting a total of 63.9-68.99 wt. % of said non-oxygen permeable ink;
- a thickener solvent constituting 20 wt. % of said non-oxygen permeable ink;
- a humectant constituting 1 wt. % of said non-oxygen permeable ink;
- and
- a surfactant constituting 0.01-0.1 wt. % of said non-oxygen permeable ink.
64-67. (canceled)
Apparatus for use in preparing a PCB product including via through-holes, the apparatus comprising:
- a common stage which is characterized in that it includes a PCB substrate supporting surface that is light scattering,
- a laser light generator causing laser light to impinge on said PCB substrate supporting surface, whereby laser light that reaches said PCB substrate supporting surface through the via through-holes is scattered so as to also impinge on sidewalls of the via through-holes, thereby causing polymerization of photoresist within the via through-holes.
Dependencies are inferred from the claim text.