Terminal connection routing
AssigneeQUALCOMM Incorporated
InventorsAniket PATIL, Hong Bok WE, Joan Rey Villarba BUOT
Life of this patent
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Abstract
Terminal connection routing on top of a substrate surface connects to component terminals to and from PMIC devices and provides a novel structure to connect surface mount technology (SMT) passive device terminals on an SMT layer (such as a Cu bar mesh) that uses the 3D space available near to components to lower resistance/lower inductive path and provides a shorter path, SIP form factor reduction, a component placement density increase, creates an additional PDN layer for connectivity and, if the routing is encapsulated in a mold, protects the metal in the connection from oxidation.
Claims24
An apparatus comprising:
- a substrate;
- a first device attached to a first surface of the substrate near a center of the substrate;
- a second device attached to the first surface of the substrate near an edge of the substrate;
- and
- a connection located on the first surface of the substrate, the connection coupled between the first device and the second device.
An apparatus comprising:
- means for supporting;
- a first device attached to a first surface of the means for supporting near a center of the means for supporting;
- a second device attached to the first surface of the means for supporting near an edge of the means for supporting;
- and
- means for connection located on the first surface of the means for supporting, the means for connection coupled between the first device and the second device.
A method for manufacturing an apparatus, the method comprising:
- providing a substrate;
- attaching a first device to a first surface of the substrate near a center of the substrate;
- attaching a second device to the first surface of the substrate near an edge of the substrate;
- and
- connecting a connection located on the first surface of the substrate between the first device and the second device.
A non-transitory computer-readable medium comprising instructions that when executed by a processor cause the processor to perform a method, the method comprising:
- providing a substrate;
- attaching a first device to a first surface of the substrate near a center of the substrate;
- attaching a second device to the first surface of the substrate near an edge of the substrate;
- and
- connecting a connection located on the first surface of the substrate between the first device and the second device.
Dependencies are inferred from the claim text.