Wiring substrate

A wiring substrate, comprising:

• an insulating layer having a through hole;
• a first conductor layer formed on a first surface of the insulating layer;
• a second conductor layer formed on a second surface of the insulating layer on an opposite side with respect to the first surface of the insulating layer;
• an interlayer connection conductor formed in the through hole such that the interlayer connection conductor is connecting the first and second conductor layers;
• and
• a resin body formed in the through hole of the insulating layer such that a volume occupancy rate of the resin body is in a range of 30% to 55% in the through hole,
• wherein the interlayer connection conductor is formed such that the interlayer connection conductor has a length in a range of 1000 μm to 2000 μm in a thickness direction of the insulating layer and that a volume occupancy rate of the interlayer connection conductor is in a range of 45% to 70% in the through hole.