Ceramic Copper Circuit Board And Method For Manufacturing The Same

A ceramic copper circuit board, comprising:

• a ceramic substrate;
• and
• a first copper part bonded to a first surface of the ceramic substrate via a first brazing material part,
• a thickness of the first copper part being 0.6 mm or more,
• a side surface of the first copper part including a first sloped portion,
• a width of the first sloped portion being not more than 0.5 times the thickness of the first copper part,
• the first brazing material part including a first jutting portion jutting from an end portion of the first sloped portion,
• a length of the first jutting portion being not less than 0 μm and not more than 200 μm,
• a contact angle between the first jutting portion and the first sloped portion being 65° or less,
• an angle of an upper end portion of the first sloped portion is 50° or more,
• the sloped portion including a protrusion and a recess.