Printed circuit board and electronic package comprising the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJe Sang Park, Sang Ho Jeong, Yong Duk Lee
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a first insulating layer; a first wiring layer having at least a portion buried in one surface side of the first insulating layer and having at least a portion of one surface exposed from the one surface of the first insulating layer; a metal post disposed on the exposed one surface of at least the portion of the first wiring layer; and a second wiring layer disposed on the other surface of the first insulating layer. A width of a first surface, connected to the exposed one surface of at least a portion of the first wiring layer, of the metal post, is greater than a width of a second surface of the metal post opposing the first surface.
Claims24
A printed circuit board, comprising:
- a first insulating layer;
- a first wiring layer having at least a portion buried in one surface of the first insulating layer and having at least a portion of one surface exposed from the one surface of the first insulating layer;
- a metal post disposed on the exposed one surface of at least the portion of the first wiring layer;
- and
- a second wiring layer disposed on the other surface of the first insulating layer,
- wherein a width of a first surface, connected to the exposed one surface of at least the portion of the first wiring layer, of the metal post, is greater than a width of a second surface of the metal post opposing the first surface.
An electronic component package, comprising:
- a printed circuit board including a plurality of insulating layers, a plurality of wiring layers, a plurality of wiring via layers, and a metal post, where the metal post is disposed on a lower surface of a lowermost wiring layer of the plurality of wiring layers and has a tapered shape of which a width of an upper surface is greater than a width of a lower surface;
- a first electronic component mounted on a lower side of the printed circuit board;
- and
- a second electronic component mounted on an upper side of the printed circuit board,
- wherein the first and second electronic components are connected to each other through the printed circuit board.
An electronic component package, comprising:
- a printed circuit board comprising:
- a first insulating layer,
- a first wiring layer having at least a portion buried in one surface of the first insulating layer, and having at least a portion of one surface exposed from the one surface of the first insulating layer,
- a metal post integrated with at least a portion of the first wiring layer and extending directly from the exposed one surface of at least the portion of the first wiring layer,
- a second wiring layer disposed on the other surface of the first insulating layer, and
- a wiring via disposed in the first insulating layer, and connecting at least portions of the first and second wiring layers to each other;
- and
- a first electronic component mounted to the printed circuit board.
Dependencies are inferred from the claim text.