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US 2022/0104345 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsGa Young YOO, Mi Sun HWANG, Jun Hyeong JANG
Life of this patent
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Abstract
A printed circuit board includes: an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer, and the first circuit layer includes a first region embedded in the insulating layer, and a second region protruding from the upper surface of the insulating layer.
Claims23
A printed circuit board, comprising:
- an insulating layer;
- and
- a first circuit layer disposed on an upper surface of the insulating layer,
- wherein the first circuit layer comprises a first region embedded in the insulating layer and a second region protruding from the upper surface of the insulating layer.
1 more element
A printed circuit board, comprising:
- an insulating layer;
- and
- a first circuit layer disposed on an upper surface of the insulating layer,
- wherein roughness of an upper surface of the first circuit layer is relatively greater than roughness of a side surface of the first circuit layer.
1 more element
A printed circuit board, comprising:
- an insulating layer;
- and
- a circuit layer disposed on an upper surface of the insulating layer and including at least a portion protruding from the upper surface.
Dependencies are inferred from the claim text.