Integrated printed circuit boards and methods of fabrication

A method for reducing the form factor of an additive manufacturing electronic (AME) circuit comprising a plurality of passive and active components using additive manufacturing comprising:

• a. providing an ink jet printing system having:
• i. a first print head adapted to dispense a dielectric ink;
• ii. a second print head adapted to dispense a conductive ink;
• iii. a conveyor, operably coupled to the first and second print heads, configured to convey a substrate to each print heads;
• and
• iv. a computer aided manufacturing (“CAM”) module in communication with the first print head, the second print heads, and the conveyor, the CAM module comprising:
• at least one processor;
• a non-volatile memory;
• and a set of executable instructions stored on the non-volatile memory, configured, when executed to cause the at least one processor to:
• 1. receive a 3D visualization file representing the infrastructure element;
• 2. using the 3D visualization file, generate a library comprising a plurality of layer files, each layer file representing a substantially 2D layer for printing of the AME circuit comprising the plurality of embedded passive and active components;
• 3. using the library, generate a conductive ink pattern comprising the conductive portion of each of the layer files for printing a conductive portion of the AME circuit
• 4. using the library, generate an ink pattern corresponding to the dielectric inkjet ink portion of each of the layer files for printing a dielectric portion of the AME circuit, wherein the CAM module is configured to control each of the first and the second print heads;
• b. providing the dielectric inkjet ink composition, and the conductive inkjet ink composition;
• c. using the CAM module, obtaining the file corresponding to the first layer;
• d. using the first print head, forming the pattern corresponding to the dielectric inkjet ink;
• e. curing the pattern corresponding to the at least one of the insulating and the dielectric inkjet ink;
• f. using the second print head, forming the pattern corresponding to the conductive inkjet ink;
• g. sintering the pattern corresponding to the conductive inkjet ink;
• and
• h. optionally coupling at least one active component to the printed first layer, wherein the conductive inkjet ink and the dielectric inkjet ink are adapted to form passive components embedded within the first layer.