Stretchable electronic device and method for manufacturing the same
AssigneeElectronics and Telecommunications Research Institute
InventorsJi-Young OH, Seung Youl KANG, Sujung KIM, Chan Woo PARK, Himchan OH, Jae-Eun PI, Chi-Sun HWANG
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Abstract
Provided are a stretchable electronic device and a method for manufacturing the same. The stretchable electronic device includes lines having lower pads, a chip provided on the lower pads and having first upper pads, which are wider than the lower pads, and an adhesive layer provided outside the lower pads or between the lower pads and bonded to the first upper pads.
Claims20
A stretchable electronic device comprising:
- lines having lower pads;
- a chip provided on the lower pads, the chip having first upper pads wider than the lower pads;
- and
- an adhesive layer provided outside the lower pads or between the lower pads, the adhesive layer bonded to the first upper pads.
A stretchable electronic device comprising:
- a stretchable substrate;
- lines disposed on the stretchable substrate, the lines having lower pads;
- a lower fixing layer configured to surround the lower pads and spaced apart from the lower pads;
- an adhesive layer provided outside the lower pads or between the lower pads within the lower fixing layer;
- and
- a chip having first upper pads aligned on the adhesive layer, the chip provided on the adhesive layer and the lower pads.
A method for manufacturing a flexible electronic device, the method comprising:
- forming lines having lower pads on a dummy substrate;
- bonding a pickup film on the lines;
- removing the dummy substrate;
- forming an adhesive layer on the pickup film outside the lower pads;
- removing the pickup film;
- and
- bonding a chip having first upper pads, which are wider than the lower pads and bonded to the adhesive layer.
Dependencies are inferred from the claim text.