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US 2022/0103726 A1Published application
Photodiode package structure, method of forming the same, and wearable device
AssigneeLextar Electronics Corporation
InventorsKai-Hung CHENG, Fu-Han HO
Life of this patent
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Abstract
According to the disclosure, a photodiode package structure is provided. The photodiode package structure includes a substrate, a photodiode chip on the substrate, a plurality of shutters above the photodiode chip, and a seal member covering the substrate and the photodiode chip, in which the shutters are embedded in the seal member.
Claims20
A photodiode package structure, comprising:
- a substrate;
- a photodiode chip on the substrate;
- a plurality of shutters above the photodiode chip;
- and
- a seal member covering the substrate and the photodiode chip, wherein the shutters are embedded in the seal member.
2 more elements
A method of forming photodiode package structure, comprising:
- providing a substrate;
- disposing a photodiode chip on the substrate;
- forming a seal member covering the photodiode chip and the substrate, wherein the seal member comprises a plurality of trenches above the photodiode chip;
- forming a non-transparent layer on the seal member and in the trenches;
- curing the non-transparent layer;
- and
- removing portions of the non-transparent layer on a top surface of the seal member, wherein remained portions of the non-transparent layer in the trenches form a plurality of shutters above the photodiode chip.
4 more elements
A wearable device, comprising:
- a carrier;
- a light source on the carrier;
- and
- a photodiode package structure adjacent to the light source on the carrier, wherein the photodiode package structure comprises a photodiode chip, a seal member covering the photodiode chip, and a plurality of shutters embedded in the seal member above the photodiode chip.
1 more element
Dependencies are inferred from the claim text.