Camera module including a housing with an adhesion surface
AssigneeLG Innotek Co., Ltd.
InventorsJi Hwan Park, Myoung Jin An
Life of this patent
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AssigneeLG Innotek Co., Ltd.
InventorsJi Hwan Park, Myoung Jin An
Estimating the term…
One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.
A camera module comprising:
A camera module comprising:
A camera module comprising:
Dependencies are inferred from the claim text.