Flexible charging pad and manufacturing method thereof
AssigneeDexin Corporation
InventorsHO-LUNG LU, SHIH-WEI PAN
Life of this patent
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Abstract
A flexible charging pad and a manufacturing method thereof are provided. The manufacturing method of the flexible charging pad includes: providing a double-sided tape to form an adhesion layer, one of two isolation papers is attached on the first adhesion surface, and another of the two isolation papers is attached on the second adhesion surface; removing the isolation paper attached on the first adhesion surface, and attaching a conductor on the first adhesion surface; attaching a first pad layer on the first adhesion surface to cover the conductor, the conductor is disposed between the first pad layer and the adhesion layer; disposing an adhesive to cover the conductor and the first pad layer, and to form a molded layer.
Claims15
A flexible charging pad, comprising:
- an adhesion layer having a first adhesion surface and a second adhesion surface respectively located at two opposite sides of the adhesion layer;
- a conductor attached on the first adhesion surface;
- a first pad layer attached on the first adhesion surface and covering the conductor, wherein the conductor is disposed between the first pad layer and the adhesion layer;
- and
- a molded layer covering the conductor and the first pad layer.
A manufacturing method of a flexible charging pad, comprising:
- providing a double-sided tape to form an adhesion layer, wherein the adhesion layer has a first adhesion surface and a second adhesion surface that are respectively located at two opposite sides of the adhesion layer, one of two isolation papers is attached on the first adhesion surface, and another of the two isolation papers is attached on the second adhesion surface;
- removing the isolation paper attached on the first adhesion surface, and attaching a conductor on the first adhesion surface;
- attaching a first pad layer on the first adhesion surface to cover the conductor, wherein the conductor is disposed between the first pad layer and the adhesion layer;
- and
- disposing an adhesive to cover the conductor and the first pad layer, and to form a molded layer through an in-mold forming process.
Dependencies are inferred from the claim text.